Prototyping and testing
Prototyping and testing
Assembly
EMV-laboratory
Prototype construction
Protoype Construction
Pironex GmbH produces prototypes as well as A-, B-, and C-samples in a very short time in order to get a first overall impression of the device. For this purpose, we use our own production resources and proven suppliers. Functional device samples are built in the shortest possible time.
Assembly
The SMD and THT prototypes are assembled either manually or automatically. For a smooth production we source the components from various distributions and catalogue suppliers.
Thanks to our flexible suppliers, we can produce sample boards and assemble these with THT within a few days.
3D Construction
Regardless of whether standard housings or customer-specific housings are used, all plugs and connections on the PCB have to be adapted.
The PCB shape is designed with assistance of the 3D design sofware Solid Works and the PCB tool Altium Designer that interact flawlessly
Customer-specific housings are optimized in terms of production costs and manufacturability. If required, mechanical construction can be performed to integrate your electronic assemblies into any installation environment. We primarily work with the 3D CAD system Solid-Works to achieve this.
Testing Equipment
We develop devices and software for the functional test and the EOL test at the manufacturer. The more complex the developed device, the bigger the functional range of the test equipment.
The test development refers to many test procedures:
- Programming of the module controllers
- Parameterization of the system components
- Assembly test with needle adapter
- Interface test with external test adapter
- Boundary-scan test
EMV laboratory
We upgraded! From now on we have the possibility to carry out even faster and more effective tests in our in-house EMC laboratory and thus to minimize the prototype development time. With our development-accompanying EMC tests, we have the opportunity to identify and correct weaknesses in the design in good time, before you incur unnecessary costs and delays in the development cycle.
Preliminary examination:
We carry out the following measurements:
- Emission measurement in GTEM cell, pre-compliance up to 3GHz, maximum test object size: 0.41 x 0.38 x 0.31 m
- Immunity measurement in GTEM cell, pre-compliance up to 1 GHz, maximum test item size for uniform field 0.167 x 0.167 x 0.167 m
- Immunity measurement with coupling clamps, possible depending on the interface
- ESD test up to 16 kV, theoretically full compliance
- Burst test on supply lines and shielded data lines, pre compliance
- Surge test on supply lines and shielded data lines, pre compliance
Acceptance examination:
On request, we will prepare the acceptance test at the external EMC laboratory and accompany the test on site:
- Burst Testing of immunity to fast transient electrical disturbances
- Conducted interference emission
- Testing of immunity to static electricity discharge
- Surge Test of interference immunity against surge voltages
- Conducted disturbances induced by HF fields
- Testing of interference immunity against voltage drops, short-term interruptions and voltage fluctuations
- Housing interference emission
